Guide to EWI at PackExpo 2016

November 6-9, 2016 | Chicago, IL | Booth E-7159

Daily Demonstrations of EWI SonicSeal™ Technology

Equipment demos at 10:30 and 2:30 daily at Booth E-7159

Stop by the EWI booth any time during PackExpo to learn about the new ultrasonic sealing technology that can reduce waste, reduce costs, and enable a wealth of other benefits to packaging companies in this infographic. View our patented sonotrode installed on a standard sealing system, then come back at 10:30 or 2:30 to see our unique technology in action.

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EWI Presentation on the Innovation Stage

Mitch Matheny, EWI’s Engineering Group Leader, will be presenting results of a manufacturing demonstration of ultrasonic sealing of thin film packaging in VFFS equipment that resulted in over five million packages introduced into retail markets.

Ultrasonic Sealing of Thin-Film Flexible Packaging Finally Reaches Commercial Maturity

Monday November 7, 1:00 PM-1:30 PM on the Innovation Stage Booth W-320

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New Ultrasonic Packaging Consortium Forming

An industry-wide consortium is being formed to collaborate and accelerate developments of ultrasonic sealing technology for the benefit of the entire packaging industry.

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Schedule a Meeting with Us at PackExpo 2016

I would like to schedule a meeting with EWI at PackExpo 2016
I am not attending PackExpo 2016 but would like more information


If you’d like to speak to someone at EWI today, please call 614.688.5000 or email

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