EWI has developed an ultrasonic package sealing technology and demonstrated commercial viability in a way not yet experienced in the packaging industry. With the original goals of reducing the amount of material used in a thin-film package and reducing costs, EWI invented EWI SonicSeal™, a new and innovative ultrasonic sealing technology for thin film packaging sealing in vertical-form-fill-seal formats. EWI SonicSeal has proven its commercial viability, delivering over 5 million products with packages produced in several factories and zero customer complaints. Unanticipated realized benefits include reduced manufacturing waste and extended shelf life.
The initial commercial implementation was proven on reciprocating style VFFS bag makers. The technology has also been demonstrated in high speed rotary VFFS bag makers with an elegant and innovative single-sonotrode design.
The documented benefits of ultrasonic sealing technology in these first applications provide impetus to further develop this technology for other packaging applications. An industry-wide consortium is being formed now to collaborate and accelerate these developments for the benefit of the packaging industry.
The Consortium will fund and oversee the execution of development programs, aiming to further refine and adapt ultrasonic sealing technology to packaging applications in order to make the technology fully suitable for commercial implementation. Potential programs for new applications include:
Consortium market and technology development will be guided by the directing members who will serve as the Advisory Board for the Consortium. Their role will be to ensure focus in the R&D activities and applications undertaken. Consumer packaged goods companies (CPGs) are expected to be the primary participants in the directing members group. Membership will be limited and will include the expectation of becoming primary users and beneficiaries of ultrasonic sealing technology.
Organizations that participate in the packaging industry value chain such as packaging equipment manufacturers, film suppliers, film converters, and resin suppliers will be invited to join the consortium as contributing members. Membership will include invitations to quarterly Consortium meetings where the technology development programs and progress will be presented. Each quarterly meeting will also feature a guest speaker from the packaging industry.
A limited number of associate memberships will be offered to academic researchers, non-profit organizations, and members of the media who wish to stay informed regarding the development of ultrasonic sealing technology.
Other Consortium Guidelines
If you’d like to speak to someone at EWI today, please call Dale Robinson, EWI, Business Development Director, Additive Manufacturing, at 614.688.5232.