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EWI has served government and commercial aerospace manufacturers and suppliers since the early 1980’s. The Department of Defense (DOD) relies on us for applied research and engineering consulting on materials joining and allied technologies on many projects. Our commercial aerospace customers count on us to help them increase operational efficiencies and competitiveness through manufacturing technology innovation.

Importantly, we help aerospace manufacturers reduce the risks associated with innovation by showing them how to apply advanced technologies to improve the performance, quality, and manufacturability of aircraft components while reducing life-cycle costs. Our extensive work with next-generation high strength steels (AHSS), advanced welding and materials joining technologies, advanced non-destructive evaluation (NDE), computational modeling and simulation, and heavy fabrication technologies gives our customers a definitive advantage.

To learn more about EWI’s experience helping aerospace manufacturers and suppliers use technology innovation to become more competitive, contact Brian Bishop, Aerospace Market Manager, at bbishop@ewi.org or 614.688.5132

 
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Recently Published: Brazing Process Promises Rapid Processing of Laminated Thin-Metal Panels
EWI Technology Leader Jerry Gould was published in the March 2015 issue of Welding…
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Hermeticity-Design and Manufacturing Challenges
There isn’t a singular, one-size-fits-all solution to creating a hermetic…
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EWI Congratulates Its 2014 Inventors
On March 11, EWI held its first-ever Inventor Recognition Luncheon…
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Increasing Fuel Economy through Lightweighting: An Overview
In 2012, the government finalized Corporate Average Fuel Economy (CAFE)…
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International Institute of Welding to meet at EWI in April
  EWI and ITW Miller Hobart  are pleased to announce that…
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Basicity Index of Welding Fluxes
By definition, the basicity index (B.I.) of a flux or…
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EWI VP Matson Featured in Columbus Business First
Mark Matson, Vice President of Human Resources, was recently named…
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Microjoining—Meeting big challenges on a small scale
Manufacturing electronic devices with materials only microns in thickness is…
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