EWI SonicSeal™ Debuts at Pack Expo 2016
By Beth Sharb on Tuesday, November 22nd, 2016
For the first time, EWI visited the international Pack Expo show held November 6-9 in Chicago to introduce EWI Sonicseal™ technology to the packaging industry.
With a demonstration booth in the exhibit hall and a presentation on the Pack Expo Innovation Stage, EWI engaged with CPGs, equipment OEMs, ultrasonic OEMs, film suppliers, and more to talk about introducing its new ultrasonic packaging technology to shop floors.
EWI SonicSeal has game-changing implications for the packaging industry across the entire value chain. It can be easily retrofitted to existing sealing machinery. EWI SonicSeal has been shown to reduce packaging material by about 8%, decrease packaging waste going to landfills, extend product shelf life, and save packagers money.
Sound too good to be true? Send us your materials and we’ll show you a stronger, better seal with EWI SonicSeal. Contact Dale Robinson, Business Development Director, at email@example.com.