News & Views

EWI SonicSeal technology on display at Pack Expo

By Dale Robinson on Friday, November 4th, 2016

sonicseal-at-pack-expoPack Expo 2016 in Chicago from November 6-9 is your chance to see EWI’s groundbreaking new ultrasonic package sealing technology. During the expo, there will be multiple opportunities during the week to learn about EWI SonicSeal™ technology firsthand.

• Visit the Innovation Stage, booth W-320 on Monday 11/7 at 1:00 for EWI Ultrasonics Team Leader Mitch Matheny’s presentation of EWI SonicSeal™ technology
• Come to our exhibit booth E-7159 to view the equipment and meet our team
• See our sealing technology in action at our booth with daily equipment demonstrations at 10:30 and 2:30

Click below for a helpful reference guide to EWI’s activities at PackExpo:

EWI at PackExpo 2016

If you’d like to set up a meeting with EWI at PackExpo, contact Dale Robinson at 614.688.5232 or, or Mitch Matheny at



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