EWI SonicSeal technology on display at Pack Expo
By Dale Robinson on Friday, November 4th, 2016
Pack Expo 2016 in Chicago from November 6-9 is your chance to see EWI’s groundbreaking new ultrasonic package sealing technology. During the expo, there will be multiple opportunities during the week to learn about EWI SonicSeal™ technology firsthand.
• Visit the Innovation Stage, booth W-320 on Monday 11/7 at 1:00 for EWI Ultrasonics Team Leader Mitch Matheny’s presentation of EWI SonicSeal™ technology
• Come to our exhibit booth E-7159 to view the equipment and meet our team
• See our sealing technology in action at our booth with daily equipment demonstrations at 10:30 and 2:30
Click below for a helpful reference guide to EWI’s activities at PackExpo: