Microjoining—Meeting big challenges on a small scale
By Dale Robinson on Monday, March 16th, 2015
Manufacturing electronic devices with materials only microns in thickness is no small task. Due to the challenges that come with the miniaturization of these devices and their components—the joining of dissimilar, often delicate materials, for example—it is crucial to develop joining processes that are reliable and repeatable. Each application calls for a different approach, and innovation is the key to producing devices that last.
Our guide, Microjoining—Meeting big challenges on a small scale, provides an overview of microjoining processes and technologies, as well as examines innovations we’ve developed to solve industry challenges.
By leveraging our capabilities and expertise in micro resistance welding, laser welding, and ultrasonic welding, we helps manufacturers increase their efficiency and get their products to market faster.
Please share this guide with anyone who might be interested in learning more about microjoining. If you have any questions, contact Dale Robinson, Business Development Manager – CIP, at firstname.lastname@example.org or 614.688.5232.