News & Announcements (Page 36)

Integrated computational materials engineering (ICME) can be used effectively to understand thermal excursions and mechanical response in single-shot joining methods such as resistance-spot, flash-butt, friction, hot-gas, and thermite welding. As part of EWI’s ongoing series of papers examining the uses of ICME as a prediction tool in manufacturing, Senior Technology Leader Jerry Gould has written...

Microjoining encompasses techniques including welding, brazing, soldering, and adhesive bonding. Typically, the technology involves materials with thicknesses less than 0.5 mm. Micro-welding techniques can be applied to join both similar and dissimilar materials combinations. Here are some key applications of microjoining today: Power electronics for electric vehicles (EVs). The integration of small-scale components, such as...

We are pleased to welcome Wolfspeed, Inc., to EWI membership. The international company, based in Durham, North Carolina, is a semiconductor company focused on silicon carbide and GaN technologies.