Resistance and ultrasonic processes can be superior to soldering when it comes to joining dissimilar materials in micro-components. Technology innovator EWI has the capabilities to do both. In this video, Senior Engineer Tim Frech takes you inside EWI’s fully equipped microjoining lab for a demonstration of parallel gap resistance welding of copper foil to a flex circuit.
The advantages of this process over soldering include:
- In-process monitoring for quality assurance
- Reduced cycle time
- Improved joint reliability
If you would like to learn more about EWI’s microjoining technologies and how we can help you with your processes, contact 614.688.5152 or [email protected].