We can help you meet demand for smaller, more dependable systems and components.
EWI can meet your needs.
With the resources to research, develop, and apply advanced manufacturing technologies quickly to both existing and new microjoining processes.
EWI’s laboratory contains equipment for every joining process used in electronic and medical device assembly, including ultrasonic and thermosonic bonders, micro-TIG welders, and precision resistance welders. Resistance reflow soldering equipment and controlled-atmosphere furnaces are also part of this lab. Our experience in joining technologies, metallurgy, materials science, and design provide a complete solution for developing new products or increasing the efficiency of currently used manufacturing techniques.
DEVELOPED PARALLEL-GAP RESISTANCE WELDING PROCESS for welding of 56 AWG copper wire to plated copper on polyimide flex circuit, to eliminate solder in an implantable medical device.
DESIGNED, BUILT, AND DEMONSTRATED FIXTURING for resistance welding drawn filled tube without exposing core material.
DEVELOPED RESISTANCE WELDING OF NITINOL WIRES TO STAINLESS STEEL to eliminate a crimp joint and reduce component size.
DESIGNED AND DEPLOYED A TIG WELDING SYSTEM for smoothing of wire ends for an ear-nose-throat surgical device.
DEVELOPED A RESISTANCE WELDING PROCESS for replacement of solder joints on a communications satellite application, including mechanical and thermal shock testing.
CURRENTLY WORKING ON IN-PROCESS INSPECTION of solder joint quality for photovoltaic solder joints.
EVALUATED SEVERAL PB-FREE SOLDERS FOR SUITABILITY in a high-reliability electrical power transmission component.