Ultrasonic technology offers a high-power tool for abroad range of manufacturing applications.
At EWI, we apply our expertise in ultrasonic technology to applications beyond ultrasonic welding and nondestructive evaluation (NDE), including cutting, machining, package sealing, additive manufacturing, powder compaction, and wire drawing. We enable manufacturers to use ultrasonic-based processes to help them:
- Optimize ultrasonic weld joint design
- Test and evaluate processes and technologies
- Design and fabricate high-powered ultrasound (HPU) systems – e.g., sonotrodes customized for a specific application
EWI’s ultrasonics team has led the industry in ultrasonic research and published foundational works in the field. With our deep understanding of ultrasonic technology and our cross-departmental strengths, we achieve our clients’ production or design goals in innovative and unexpected ways.
WE MANUFACTURE INNOVATION.
That’s how we surmount unique challenges with customized ultrasonic solutions to further the success of our partners. Our ultrasonics team is ready to help your organization.
Spotlight on Ultrasonic Package Sealing
EWI UltraThinSeal, an affiliate of EWI, is a pioneer of ultrasonic packaging technology. The company spun out of EWI to bring its unique technology to packaging-industry players worldwide.
The EWI UltraThinSeal system utilizes the basic mechanics of ultrasonic welding in patented ultrasonic technology that joins extremely delicate materials – snack package films – to create strong seals as small as 1mm. Compared to traditional thermal sealing, this system produces better seal quality and far less waste, and it’s viable for biodegradable materials and PLA.