By Tom McGaughy
on Wednesday, July 5th, 2017 in Advanced Manufacturing, Aerospace, Arc Welding, Automotive, Composites Joining, Dissimilar Metals Joining, EWI – Company, Forming, Heavy Industry, Heavy Manufacturing, Laser Processing, Manufacturing Competitiveness, Manufacturing Innovation, Manufacturing Technology, Microjoining, Plastics Joining, Soldering and Brazing.
EWI and the National Institute of Standards and Technology (NIST) recently completed an exhaustive, two-year study to identify and prioritize technology development needs in materials joining and forming technologies and provide key recommendations to increase competitiveness of U.S. manufacturing. This study — possibly the most in-depth national review and assessment of these essential manufacturing capabilities conducted toRead more
By Rebecca Gurk
on Thursday, April 6th, 2017 in Advanced Manufacturing, Aerospace, Arc Welding, Automotive, Composites Joining, Dissimilar Metals Joining, Events, EWI – Company, Forming, Friction Processes, Government, Manufacturing Competitiveness, Manufacturing Innovation, Manufacturing Technology, Materials Engineering, Microjoining, Technology Innovation.
Last month EWI issued “Developing a U.S. Roadmap for Advanced Joining and Forming Technologies,” an overview describing the comprehensive NIST-funded study conducted by EWI to identify and prioritize the top joining and forming challenges within the manufacturing industry. To share the results and recommendations of this timely report, EWI will present an online seminar, Introducing aRead more
By Tom McGaughy
on Friday, March 31st, 2017 in Advanced Manufacturing, Aerospace, Arc Welding, Automotive, Consumer Electronics, Defense, Dissimilar Metals Joining, Events, EWI – Company, Forming, Friction Processes, Government, Heavy Industry, Heavy Manufacturing, Lightweighting, Manufacturing Technology, Microjoining, Oil & Gas, Packaging, Plastics Joining, Rail, Ultrasonic Processes.
Recently, EWI led the development of the first comprehensive U.S. Advanced Joining and Forming Technology Roadmap under a program funded by The National Institute of Standards and Technology (NIST) through the Advanced Manufacturing Technology Consortia (AMTech) program. The goal of this two-year effort was to develop a prioritized list of research and development topics aimedRead more
By Rebecca Gurk
on Tuesday, February 21st, 2017 in Composites Joining, Consumer Electronics, Microjoining, Plastics Joining, Ultrasonic Processes.
When the question “What is Ultrasonic Welding?” appeared on the Q&A website Quora, EWI Applications Engineer Miranda Marcus stepped up to reply. Her succinct essay, covering both metal welding style and plastics welding style, is a clear and straightforward introduction for the technically curious. To read Miranda’s brief article on quora.com, click here.
By Nadine Powell
on Tuesday, February 14th, 2017 in Consumer Electronics, Manufacturing Innovation, Membership, Microjoining.
EWI welcomes Bak USA as a new member company. Bak seeks to make mobile technologies accessible to every person on earth, a mission put into motion through infrastructure work in Haiti after the catastrophic earthquake in 2010. Today Bak, headquartered in Buffalo, NY, employs a local workforce to build mobile computers for educational, not-for-profit, retail,Read more
By Marcie Willard
on Monday, November 21st, 2016 in Additive Manufacturing, Advanced Automation, EWI – Company, EWI Network, First Time Quality, Flexible Automation, In-Process Monitoring, In-Process Sensing, Manufacturing Competitiveness, Manufacturing Technology, Metal 3D Printing, Microjoining, NDE and Inspection, Technology Innovation.
On November 9, EWI celebrated the opening of its third R&D facility, EWI Colorado. Located in Loveland at the Rocky Mountain Center for Innovation and Technology, EWI Colorado joins labs in Ohio and New York as the company’s newest manufacturing center of excellence. More than 200 representatives from manufacturing firms and organizations, educational institutions, andRead more
By Dale Robinson
on Monday, March 16th, 2015 in EWI – Company, Microjoining.
Manufacturing electronic devices with materials only microns in thickness is no small task. Due to the challenges that come with the miniaturization of these devices and their components—the joining of dissimilar, often delicate materials, for example—it is crucial to develop joining processes that are reliable and repeatable. Each application calls for a different approach, andRead more