What is Ultrasonic Welding?

By Rebecca Gurk on Tuesday, February 21st, 2017 in Composites Joining, Consumer Electronics, Microjoining, Plastics Joining, Ultrasonic Processes. No Comments

When the question “What is Ultrasonic Welding?” appeared on the Q&A website Quora, EWI Applications Engineer Miranda Marcus stepped up to reply. Her succinct essay, covering both metal welding style and plastics welding style, is a clear and straightforward introduction for the technically curious. To read Miranda’s brief article on quora.com, click here.    

Bak is New EWI Member

By Nadine Powell on Tuesday, February 14th, 2017 in Consumer Electronics, Manufacturing Innovation, Membership, Microjoining. No Comments

EWI welcomes Bak USA as a new member company. Bak seeks to make mobile technologies accessible to every person on earth, a mission put into motion through infrastructure work in Haiti after the catastrophic earthquake in 2010. Today Bak, headquartered in Buffalo, NY, employs a local workforce to build mobile computers for educational, not-for-profit, retail,Read more

EWI Colorado Hosts Facility Premiere; Opens Doors to Statewide Audience

By Marcie Erion on Monday, November 21st, 2016 in Additive Manufacturing, Advanced Automation, EWI – Company, EWI Network, First Time Quality, Flexible Automation, In-Process Monitoring, In-Process Sensing, Manufacturing Competitiveness, Manufacturing Technology, Metal 3D Printing, Microjoining, NDE and Inspection, Technology Innovation. No Comments

On November 9, EWI celebrated the opening of its third R&D facility, EWI Colorado. Located in Loveland at the Rocky Mountain Center for Innovation and Technology, EWI Colorado joins labs in Ohio and New York as the company’s newest manufacturing center of excellence. More than 200 representatives from manufacturing firms and organizations, educational institutions, andRead more

Microjoining—Meeting big challenges on a small scale

By Dale Robinson on Monday, March 16th, 2015 in EWI – Company, Microjoining. No Comments

Manufacturing electronic devices with materials only microns in thickness is no small task. Due to the challenges that come with the miniaturization of these devices and their components—the joining of dissimilar, often delicate materials, for example—it is crucial to develop joining processes that are reliable and repeatable. Each application calls for a different approach, andRead more